ZMDI offers products available in a wide variety of package types optimized for each individual application requirement.
Our packages are RoHS compliant and include tin lead finishing, standard moisture level classification MSL3 (MSL1 also available).  For high-temperature applications, we offer special packaging options with heat resistance greater than 5,000 hours at 150ºC.
For products with complex and high-performance analog functions (especially in combination with Multi-Chip-Packages) ZMDI effectively uses best in class package simulation methodologies for 1st time right success.
ZMDI provides a full back-end service including final test, dry bake, scan, tape and real, and dry pack.

Package Portfolio

Lead Frame Packages

Laminate Packages

BGA, FBGA, LGA

Wafer-Level Packages

Chip Scale Package (CSP)

Multi-Chip Packages

Side-by-Side Option

Stacked Option

System in Package (SiP)

For Products with complex and high performance analog functions esp. in combination with Multi-Chip-Packages, ZMDI effectively uses best in class simulation methodology for 1st time right success.